TensorCIM: Digital Computing-In-Memory Tensor Processor with Multi-Chip-Module-based Architecture for Beyond-NN Acceleration

Y. Wang, Z. Wu, W. Wu, L. Liu, Y. Hu, S. Wei, F. Tu, S. Yin

January 2025

Abstract

Co-Corresponding Author, ISSCC'23 Extension

Type

Journal article

Publication

IEEE Journal of Solid-State Circuits (JSSC)